| Code | Description | Unit | General Rate |
|---|---|---|---|
| 8486-10 | Machines and apparatus for the manufacture of boules or wafers: | — | 0% |
| 8486-10-10 | Machines and apparatus, as follows: for growing or pulling monocrystal semiconductor boules;machine-tools for working material by removal of material, by the processes specified in 8456 (including laser or other light or photon beam, ionic-beam or electron beam processes);spin dryers for semiconductor wafer processing; sawing machines for sawing monocrystal semiconductor boules into slices;grinding, polishing or lapping machines;industrial or laboratory electric furnaces or ovens | .. | 0% |
| 8486-10-20 | Machines and apparatus, NSA, which, but for the operation of Note 11(D) to this Chapter, would be classified in 8543.70.00 | .. | 0% |
| 8486-10-30 | Machines and apparatus, NSA, for the treatment of materials by a process involving a change of temperature | .. | 5% |
| 8486-10-90 | Other | .. | 5% |
| 8486-20 | Machines and apparatus for the manufacture of semiconductor devices or of electronic integrated circuits | — | 0% |
| 8486-20-10 | Machines and apparatus, as follows: appliances (including spraying appliances) for wet-etching, developing, stripping or cleaning semiconductor wafers;physical deposition apparatus (including apparatus for deposition by sputtering) on semiconductor wafers;chemical vapour deposition apparatus;machine-tools for working material by removal of material, by the processes specified in 8456 (including laser or other light or photon beam, ionic-beam or electron beam processes);epitaxial deposition machines; industrial or laboratory electric furnaces or ovens;spinners for coating photographic emulsions on semiconductor wafers;for dry-etching patterns on semiconductor materials;ij. ion implanters for doping semiconductor materials;apparatus for the projection or drawing of circuit patterns on sensitised semiconductor materials;sawing machines for sawing wafers into chips;dicing machines for scribing or scoring semiconductor wafers | .. | 0% |
| 8486-20-20 | Machines and apparatus, NSA, which, but for the operation of Note 11(D) to this Chapter, would be classified in 8543.70.00 | .. | 0% |
| 8486-20-30 | Machines and apparatus, NSA, which, but for the operation of Note 11(D) to this Chapter, would be classified in 8477 | No | 5% |
| 8486-20-40 | Centrifuges, including centrifugal dryers | No | From 1 January 2017:3.75%From 1 July 2017:2.5%From 1 July 2018:1.25%From 1 July 2019:Free |
| 8486-20-90 | Other | .. | 5% |
| 8486-30 | Machines and apparatus for the manufacture of flat panel displays: | — | 0% |
| 8486-30-10 | Goods, as follows: apparatus for wet-etching, developing, stripping or cleaning of flat panel displays; apparatus and equipment for projection, drawing or plating circuit patterns, used for the manufacture of flat panel displays;machine-tools for working material by removal of material, by the processes specified in 8456 (including laser or other light or photon beam, ionic-beam or electron beam processes); spinners for coating photographic emulsions | .. | 0% |
| 8486-30-20 | Machines and apparatus, NSA, which, but for the operation of Note 11(D) to this Chapter, would be classified in 8543.70.00 | .. | 0% |
| 8486-30-30 | Mechanical appliances for projecting, dispersing or spraying liquids, for use in the manufacture of flat panel displays, NSA | No | 5% |
| 8486-30-40 | Centrifuges, including centrifugal dryers | No | 5% |
| 8486-30-90 | Other | .. | 5% |
| 8486-40 | Machines and apparatus specified in Note 11(C) to this Chapter: | — | 0% |
| 8486-40-10 | Machines and apparatus, as follows: machine-tools for working material by removal of material, by the processes specified in 8456 (including laser or other light or photon beam, ionic-beam or electron beam processes); optical and other microscopes;drawing or marking-out instruments;die attach apparatus, tape automated bonders, and wire bonders for the assembly of semiconductors;encapsulation equipment for the assembly of semiconductors;for bending, folding and straightening semiconductor leads; soldering, brazing or welding machines, of a kind described in 8515, for working metal, incorporating a computer control;industrial robots, being automated machines for transport, handling and storage of semiconductor wafers, wafer cassettes or wafer boxes;ij. injection or compression moulds for rubber or plastics for the manufacture of semiconductor devices | .. | 0% |
| 8486-40-20 | Machines and apparatus, NSA, which, but for the operation of Note 11(D) to this Chapter, would be classified in 8543.70.00 | .. | 0% |
| 8486-40-3 | Machines and apparatus, NSA, which, but for the operation of Note 11(D) to this Chapter, would be classified in 8477 or 8480.71.00: | — | 0% |
| 8486-40-31 | Injection or compression moulds for rubber or plastics, other than goods of 8486.40.10 | .. | 5% |
| 8486-40-39 | Other | .. | 5% |
| 8486-40-40 | Deflash machines for cleaning and removing contaminants from the metal leads of semiconductor packages prior to the electroplating process | No | 0% |
| 8486-40-9 | Other, including machinery for lifting, handling, loading or unloading of boules, wafers, semiconductor devices, electronic integrated circuits and flat panel displays: | — | 0% |
| 8486-40-91 | Machinery for lifting, handling, loading or unloading of boules, wafers, semiconductor devices, electronic integrated circuits and flat panel displays | No | From 1 January 2017:3.75%From 1 July 2017:2.5%From 1 July 2018:1.25%From 1 July 2019:Free |
| 8486-40-99 | Other | No | 5% |
| 8486-90 | Parts and accessories: | — | 0% |
| 8486-90-10 | Of goods of 8486.10.10, 8486.20.10, 8486.30.10 and 8486.40.10, other than goods of 8486.90.40 | .. | 0% |
| 8486-90-20 | Of goods of 8486.10.20, 8486.20.20, 8486.30.20 and 8486.40.20 | .. | 5% |
| 8486-90-30 | Of goods of 8486.20.30 and 8486.40.3 | .. | 5% |
| 8486-90-40 | Of soldering, brazing or welding machines of a kind described in 8515 | .. | 5% |
| 8486-90-50 | Of machine-tools of a kind described in 8464, NSA | No | 0% |
| 8486-90-60 | Of goods of 8486.30.30 or 8486.40.40 | .. | 5% |
| 8486-90-70 | Which, but for the operation of Note 11(D) to this Chapter, would be classified in 8466.10.00, 8466.20.00 or 8466.30.00 | .. | 0% |
| 8486-90-9 | Other: | — | 0% |
| 8486-90-91 | Of goods of 8486.10.30 | .. | From 1 January 2017:3.75%From 1 July 2017:2.5%From 1 July 2018:1.25%From 1 July 2019:Free |
| 8486-90-92 | Of goods of 8486.20.40 or 8486.30.40 | .. | 5% |
| 8486-90-93 | Of goods of 8486.40.91 | .. | From 1 January 2017:3.75%From 1 July 2017:2.5%From 1 July 2018:1.25%From 1 July 2019:Free |
| 8486-90-99 | Other | .. | 5% |
These Free Trade Agreements may offer reduced duty rates for HS 8486 products:
Heading 8486 belongs to Chapter 84 in Section XVI (Machinery; electrical equipment).
Important
Rates shown are general (MFN) duty rates. Total landed cost includes GST (10% on CIF + duty), Import Processing Charge ($50-
The general (MFN) duty rate for HS 8486 (Machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays; machines and apparatus specified in Note 11 (C) to this chapter; parts and accessories) is 0%. Preferential rates may be available under 17 Free Trade Agreements.
There are 40 statistical codes under heading 8486 in the Australian tariff schedule. See the full table below for rates and descriptions.
Get the total landed cost for HS 8486 — duty, GST, IPC, and biosecurity included.